The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Aug. 22, 2007
Atsushi Kazuno, Osaka, JP;
Tetsuo Shimomura, Osaka, JP;
Yoshiyuki Nakai, Osaka, JP;
Kazuyuki Ogawa, Osaka, JP;
Tsuyoshi Kimura, Osaka, JP;
Atsushi Kazuno, Osaka, JP;
Tetsuo Shimomura, Osaka, JP;
Yoshiyuki Nakai, Osaka, JP;
Kazuyuki Ogawa, Osaka, JP;
Tsuyoshi Kimura, Osaka, JP;
Toyo Tire & Rubber Co., Ltd., Osaka-shi, JP;
Abstract
A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4'-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.