The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Apr. 21, 2008
Sudarsanam S. Babu, Dublin, OH (US);
Chris Conrardy, Columbus, OH (US);
Shuchi P. Khurana, Columbus, OH (US);
Wei Zhang, Upper Arlington, OH (US);
Wei Gan, Lewis Center, OH (US);
Sudarsanam S. Babu, Dublin, OH (US);
Chris Conrardy, Columbus, OH (US);
Shuchi P. Khurana, Columbus, OH (US);
Wei Zhang, Upper Arlington, OH (US);
Wei Gan, Lewis Center, OH (US);
Edison Welding Institute, Inc., Columbus, OH (US);
Abstract
A remote high-performance computing material joining and material forming modeling system () enables a remote user () using a user input device () to use high speed computing capabilities to model materials joining and material forming processes. The modeling system () includes an interface module (), an application module (), a computing module (), and a scheduling module (). The interface module () is in operative communication with the user input device (), as well as the application module (), the computing module (), and the scheduling module (). The application module () is in operative communication with the interface module () and the computing module (). The scheduling module () is in operative communication with the interface module () and the computing module (). Lastly, the computing module () is in operative communication with the interface module (), the application module (), and the scheduling module ().