The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Jun. 11, 2009
Takeshi Horiguchi, Osaka, JP;
Takashi Matsui, Osaka, JP;
Motoji Shiota, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
Provided is a semiconductor element in which decrease in reliability of wiring is suppressed. A driver IC () has a plurality of output bumps () arranged in the direction (direction A) along the long sides (and). The output bumps include a plurality of source bumps () arranged near the center section of the long side, and a plurality of gate bumps () arranged towards the end portions of the long side. The source bumps are arranged close to the long side (), and the gate bumps are arranged closer to the long side () than the source bumps.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile