The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Dec. 01, 2009
Applicants:
Andy Peczalski, Eden Prarie, MN (US);
Robert E. Higashi, Shorewood, MN (US);
Gordon Alan Shaw, Plymouth, MN (US);
Thomas Keyser, Plymounth, MN (US);
Inventors:
Andy Peczalski, Eden Prarie, MN (US);
Robert E. Higashi, Shorewood, MN (US);
Gordon Alan Shaw, Plymouth, MN (US);
Thomas Keyser, Plymounth, MN (US);
Assignee:
Honeywell International Inc., Morristown, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming CMOS circuitry integrated with MEMS devices includes bonding a wafer to a top surface layer having contacts formed to CMOS circuitry. A handle wafer is then removed from one of the top or bottom surfaces of the CMOS circuitry, and MEMS devices are formed in a remaining silicon layer.