The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2012

Filed:

Oct. 28, 2010
Applicants:

Gaku Furuta, Sunnyvale, CA (US);

Soo Young Choi, Fremont, CA (US);

Omori Kenji, Osaka, JP;

Inventors:

Gaku Furuta, Sunnyvale, CA (US);

Soo Young Choi, Fremont, CA (US);

Omori Kenji, Osaka, JP;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention generally relate to a TFT and a method for its fabrication. The TFT disclosed herein is a silicon based TFT in which the active channel comprises amorphous silicon. Over the amorphous silicon, multiple layers of doped silicon are deposited in which the resistivity of the doped silicon layers is higher at the interface with the amorphous silicon layer as compared to the interface with the source and drain electrodes. Alternatively, a single doped silicon layer is deposited over the amorphous silicon in which the properties of the single doped layer change throughout the thickness. It is better to have a lower resistivity at the interface with the source and drain electrodes, but lower resistivity usually means less substrate throughput. By utilizing multiple or graded layers, low resistivity can be achieved. The embodiments disclosed herein include low resistivity without sacrificing substrate throughput.


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