The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Nov. 02, 2010
Mutsumi Masumoto, Beppu, JP;
Mutsumi Masumoto, Beppu, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device has a chip () with gold studs () assembled on a tape substrate (), which has solder balls () for attachment to external parts. The tape substrate (about 30 to 70 μm thick) has on its first surface first copper contact pads () covered with a continuous thin nickel layer () of about 0.04 to 0.12 μm thickness. Gold including stud () is contacting the nickel. On the second substrate surface are second copper contact pads () covered with an alloy layer (about 2 to 3 μm thick) including gold, copper/tin alloys, and copper/nickel/tin alloys; the alloys are metallurgically attached to the second copper pad and substantially free of unalloyed nickel. A reflow body () comprising tin is metallurgically attached to the alloy layer of each second pad.