The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Mar. 24, 2011
Applicants:
Richard Fournel, Lumbin, FR;
Yves Dodo, Moirans, FR;
Inventors:
Richard Fournel, Lumbin, FR;
Yves Dodo, Moirans, FR;
Assignees:
STMicroelectronics SA, Montrouge, FR;
STMicroelectronics (Crolles 2) SAS, Crolles, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for forming through vias connecting the front surface to the rear surface of a semiconductor substrate, including the steps of: forming openings in the substrate, thermally oxidizing walls of the openings, filling the openings with a sacrificial material, forming electronic components in the substrate, etching the sacrificial material, filling the openings with a metal, and etching the rear surface of the substrate all the way to the bottom of the openings.