The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Dec. 09, 2010
Takashi Oda, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Mitsuaki Fusumada, Ibaraki, JP;
Nitto Denko Corporation, Ibaraki-shi, JP;
Abstract
Provided is a method of producing a semiconductor device having a structure wherein a semiconductor chipis mounted on a wiring circuit substrateand sealed with a resin. A wiring circuit substratehaving a connecting conductor portion that can be connected to an electrode of the chip is formed on a metal support layerin a way such that the substrate can be separated from the metal support layer, the chipis mounted on the wiring circuit substratea sheet-shaped resin composition T is placed on the chip and heated on the chip to seal the chip, and the metal support layer is separated and divided to obtain individual semiconductor devices.