The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Mar. 19, 2009
Applicants:
Mitsuo Maeda, Tsukuba, JP;
Yasuo Matsumi, Tsukuba, JP;
Inventors:
Mitsuo Maeda, Tsukuba, JP;
Yasuo Matsumi, Tsukuba, JP;
Assignee:
Sumitomo Chemical Company, Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract
The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.