The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Dec. 14, 2009
Yoshimasa Kushima, Yamanashi, JP;
Yoshimasa Kushima, Yamanashi, JP;
Oki Semiconductor Co., Ltd., Tokyo, JP;
Abstract
An improved manufacturing method for semiconductor devices is provided. This method can prevent chips and cracks from being generated when the rear face of the semiconductor substrate is polished. The manufacturing method includes preparing a semiconductor substrate having a front face and a rear face. The front face has an inner surface area and a peripheral surface area. Circuit elements are provided in the inner surface area of the semiconductor substrate. The manufacturing method also includes sealing the circuit elements with circuit sealing resin. The manufacturing method also includes providing cured resin in the peripheral surface area of the semiconductor substrate. The manufacturing method also includes polishing the rear face of the semiconductor substrate after the circuit sealing step. The manufacturing method also includes cutting the semiconductor substrate after the substrate polishing step so as to obtain semiconductor devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile