The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2012

Filed:

Jun. 27, 2007
Applicants:

Takashi Itoi, Tochigi, JP;

Koji Mimura, Tochigi, JP;

Daisuke Yamazaki, Wakayama, JP;

Masafumi Miyamoto, Wakayama, JP;

Tetsuji Kito, Wakayama, JP;

Seiichi Miyanaga, Tokyo, JP;

Hirohiko Ishida, Tokyo, JP;

Inventors:

Takashi Itoi, Tochigi, JP;

Koji Mimura, Tochigi, JP;

Daisuke Yamazaki, Wakayama, JP;

Masafumi Miyamoto, Wakayama, JP;

Tetsuji Kito, Wakayama, JP;

Seiichi Miyanaga, Tokyo, JP;

Hirohiko Ishida, Tokyo, JP;

Assignee:

Kao Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61L 9/01 (2006.01); A61K 9/00 (2006.01); C08F 2/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a deodorant particle having a BET specific surface area of 10 m/g or more that are obtained by copolymerizing a monomer system including a crosslinkable vinyl monomer and a vinyl monomer having a heteroaromatic ring. The deodorant particles may contain a metal ion. Also disclosed is a process of producing the deodorant particles including the step of copolymerizing a monomer system containing a crosslinkable vinyl monomer and a vinyl monomer having a heteroaromatic ring by oil-in-water emulsion polymerization or precipitation polymerization using an organic solvent whose solubility parameter is different from that of the monomers by an absolute difference of 0 to 2.0. The process can further include the step of bringing the particles obtained by the polymerization into contact with a solvent having a metal salt dissolved therein to support a metal ion on the particle.


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