The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Mar. 16, 2007
Seah Sun Too, San Jose, CA (US);
Raj N. Master, San Jose, CA (US);
Jacquana Diep, San Jose, CA (US);
Mohammad Khan, San Jose, CA (US);
Seah Sun Too, San Jose, CA (US);
Raj N. Master, San Jose, CA (US);
Jacquana Diep, San Jose, CA (US);
Mohammad Khan, San Jose, CA (US);
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.