The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Aug. 19, 2008
David Oliver Burke, Balmain, AU;
Jan Waszczuk, Balmain, AU;
Desmond Bruce Boyton, Balmain, AU;
Craig Donald Strudwicke, Balmain, AU;
Peter John Morley Sobey, Balmain, AU;
William Granger, Balmain, AU;
Jason Mark Thelander, Balmain, AU;
Eric Patrick O'donnell, Balmain, AU;
David Oliver Burke, Balmain, AU;
Jan Waszczuk, Balmain, AU;
Desmond Bruce Boyton, Balmain, AU;
Craig Donald Strudwicke, Balmain, AU;
Peter John Morley Sobey, Balmain, AU;
William Granger, Balmain, AU;
Jason Mark Thelander, Balmain, AU;
Eric Patrick O'Donnell, Balmain, AU;
Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;
Abstract
The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.