The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Nov. 07, 2008
Jimin Zhang, San Jose, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Stephen Jew, San Jose, CA (US);
Jimin Zhang, San Jose, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Stephen Jew, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring system. A projected thickness that each substrate will have at a target time is determined based on the measurement data. The polishing parameter for at least one substrate is adjusted to adjust the polishing rate of the at least one substrate such that the substrates have closer to the same thickness at the target time than without the adjustment.