The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Feb. 25, 2011
Stuart Rosenberg, Castaic, CA (US);
Cecilia Q. Xi, San Jose, CA (US);
Yelena Nabutovsky, Sunnyvale, CA (US);
Brian J. Wenzel, San Jose, CA (US);
Jong Gill, Valencia, CA (US);
William Hsu, Thousand Oaks, CA (US);
Stuart Rosenberg, Castaic, CA (US);
Cecilia Q. Xi, San Jose, CA (US);
Yelena Nabutovsky, Sunnyvale, CA (US);
Brian J. Wenzel, San Jose, CA (US);
Jong Gill, Valencia, CA (US);
William Hsu, Thousand Oaks, CA (US);
Pacesetter, Inc., Sylmar, CA (US);
Abstract
Techniques are provided for use with implantable medical devices for addressing encapsulation effects, particularly in the detection of cardiac decompensation events such as heart failure (HF) or cardiogenic pulmonary edema (PE.) In one example, during an acute interval following device implant, cardiac decompensation is detected using heart rate variability (HRV), ventricular evoked response (ER) or various other non-impedance-based parameters that are insensitive to component encapsulation effects. During the subsequent chronic interval, decompensation is detected using intracardiac or transthoracic impedance signals. In another example, the degree of maturation of encapsulation of implanted components is assessed using impedance frequency-response measurements or based on the frequency bandwidth of heart sounds or other physiological signals. In this manner, impedance-based HF/PE detection systems can be activated as soon as component encapsulation has matured, without necessarily waiting until completion of a preset post-implant maturation interval, often set to forty-five days or more.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile