The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8294214 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 23, 2012

Filed:

Nov. 18, 2009
Applicants:

Shinya Suzuki, Kodaira, JP;

Kazuhisa Higuchi, Tachikawa, JP;

Inventors:

Shinya Suzuki, Kodaira, JP;

Kazuhisa Higuchi, Tachikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/62 (2006.01); H01L 23/522 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
Abstract

Signal lines which provide electric connections from an internal circuit formed on a main surface of a semiconductor chip and including, for example, MIS transistor to protective elements constituted by, for example, diodes are drawn out from outlet ports formed on wiring lines disposed between the protective elements, and a signal line region occupied by the signal lines is provided over the protective elements and under electrode pads. A wiring region on the main surface of the semiconductor chip can be enlarged without increasing the chip area.


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Suzuki, Shinya. (2012). Semiconductor device with signal wirings and dummy wirings that pass through under electrode pads and in which the number of dummy wirings near the peripheral portion of the device being greater than at a more centrally located portion (U.S. Patent No. 8294214). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8294214

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