The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Oct. 10, 2003
Yasunori Miki, Tsu, JP;
Hiroshi Yanagida, Kameyama, JP;
Shouichi Nagata, Aki-gun, JP;
Shin Sato, Tsu, JP;
Yoshiyuki Uchinono, Hirakata, JP;
Kenji Jonen, Tsu, JP;
Masaharu Ishikawa, Suzuka, JP;
Hiroshi Iwano, Tsu, JP;
Syunichi Nakayama, Tsu, JP;
Yasunori Miki, Tsu, JP;
Hiroshi Yanagida, Kameyama, JP;
Shouichi Nagata, Aki-gun, JP;
Shin Sato, Tsu, JP;
Yoshiyuki Uchinono, Hirakata, JP;
Kenji Jonen, Tsu, JP;
Masaharu Ishikawa, Suzuka, JP;
Hiroshi Iwano, Tsu, JP;
Syunichi Nakayama, Tsu, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.