The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Jul. 13, 2010
Tatsuya Hirai, Kanagawa, JP;
Tomoaki Hashimoto, Kanagawa, JP;
Takashi Kikuchi, Kanagawa, JP;
Masatoshi Yasunaga, Kanagawa, JP;
Michiaki Sugiyama, Kanagawa, JP;
Tatsuya Hirai, Kanagawa, JP;
Tomoaki Hashimoto, Kanagawa, JP;
Takashi Kikuchi, Kanagawa, JP;
Masatoshi Yasunaga, Kanagawa, JP;
Michiaki Sugiyama, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes.