The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Dec. 16, 2010
Tilman W. Beutel, Neshanic Station, NJ (US);
Ivor Bull, Hopewell Junction, NY (US);
Ahmad Moini, Princeton, NJ (US);
Michael Breen, Erie, PA (US);
Martin Dieterle, Jersey City, NJ (US);
Saeed Alerasool, Princeton Junction, NJ (US);
Xinsheng Liu, Edison, NJ (US);
Wenyong Lin, Edison, NJ (US);
Barbara Slawski, North Royalton, OH (US);
Ulrich Mueller, Neustadt, DE;
Tilman W. Beutel, Neshanic Station, NJ (US);
Ivor Bull, Hopewell Junction, NY (US);
Ahmad Moini, Princeton, NJ (US);
Michael Breen, Erie, PA (US);
Martin Dieterle, Jersey City, NJ (US);
Saeed Alerasool, Princeton Junction, NJ (US);
Xinsheng Liu, Edison, NJ (US);
Wenyong Lin, Edison, NJ (US);
Barbara Slawski, North Royalton, OH (US);
Ulrich Mueller, Neustadt, DE;
BASF Corporation, Florham Park, NJ (US);
Abstract
Disclosed are processes for the preparation of copper containing molecular sieves with the CHA structure wherein the copper is exchanged into the Na-form of the Chabazite, using a liquid copper solution wherein the concentration of copper is in the range of about 0.001 to about 0.4 molar. Also described are copper containing molecular sieves with the CHA structure, catalysts incorporating molecular sieves, systems and methods for their use.