The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Mar. 24, 2011
Hiroyuki Semba, Osaka, JP;
Atsuro Iseda, Osaka, JP;
Hiroyuki Hirata, Osaka, JP;
Kaori Kawano, Osaka, JP;
Masaaki Igarashi, Osaka, JP;
Osamu Miyahara, Osaka, JP;
Hiroyuki Semba, Osaka, JP;
Atsuro Iseda, Osaka, JP;
Hiroyuki Hirata, Osaka, JP;
Kaori Kawano, Osaka, JP;
Masaaki Igarashi, Osaka, JP;
Osamu Miyahara, Osaka, JP;
Sumitomo Metal Industries, Ltd., Osaka, JP;
Abstract
A high strength, ductile, and tough Ni-base heat resistant alloy comprises by mass percent, C: 0.1% or less, Si: 1% or less, Mn: 1% or less, Cr: not less than 15% to less than 28%, Fe: 15% or less, W: more than 5% to not more than 20%, Al: more than 0.5% to not more than 2%, Ti: more than 0.5% to not more than 2%, Nd: 0.001 to 0.1% and B: 0.0005 to 0.01%, with the balance being Ni and impurities. Impurity contents of P, S, Sn, Pb, Sb, Zn and As are P: 0.03% or less, S: 0.01% or less, Sn: 0.020% or less, Pb: 0.010% or less, Sb: 0.005% or less, Zn: 0.005% or less and As: 0.005% or less, and formulas of [0.015≦Nd+13.4×B≦0.13], [Sn+Pb≦0.025] and [Sb+Zn +As≦0.010] are met.