The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Nov. 15, 2006
Fumio Kurihara, Tokyo, JP;
Masamitsu Takami, Tokyo, JP;
Koichi Abe, Tokyo, JP;
Shinichi Iso, Tokyo, JP;
Fumio Kurihara, Tokyo, JP;
Masamitsu Takami, Tokyo, JP;
Koichi Abe, Tokyo, JP;
Shinichi Iso, Tokyo, JP;
Techno Polymer Co., Ltd., Tokyo, JP;
Nihon Rex Co., Ltd., Tokyo, JP;
Abstract
A resin forming method and a resin forming apparatus for obtaining a resin formed product, by filling a cavity of a rubber-made mold with a thermoplastic resin, and cooling the thermoplastic resin. When filling the cavity with the thermoplastic resin, an electromagnetic wave generator is used, and electromagnetic waves having an intensity peak in a wavelength region of 0.78 to 2 μm are irradiated to the thermoplastic resin from the surface of the mold, and thereby the thermoplastic resin is heated selectively from the mold. The thermoplastic resin is an ABS resin which either a noncrystalline thermoplastic resin, or is a rubber modified thermoplastic resin.