The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Nov. 29, 2005
Hiroshi Yokoyama, Tokyo, JP;
Hiroshige Okamoto, Tokyo, JP;
Muneaki Aminaka, Tokyo, JP;
Kouji Takeuchi, Tokyo, JP;
Hironobu Yamauchi, Tokyo, JP;
Ken Someya, Tokyo, JP;
Hiroshi Yokoyama, Tokyo, JP;
Hiroshige Okamoto, Tokyo, JP;
Muneaki Aminaka, Tokyo, JP;
Kouji Takeuchi, Tokyo, JP;
Hironobu Yamauchi, Tokyo, JP;
Ken Someya, Tokyo, JP;
Asahi Kasei Chemicals Corporation, Tokyo, JP;
Abstract
A method for producing a molded product consisting of a resin polymerized by a melt polycondensation reaction, comprising continuous feeding of a prepolymer in molten state from a prepolymer feeding port to a polymerization reactor, discharging from holes of a porous plate, followed by polymerization while dropping along a supporting substrate under reduced pressure, and molding by transferring to at least one molding machine in molten state without solidification, wherein transfer pressure to said molding machine is controlled so as to maintain at an arbitrary pressure from 0.1 to 100 MPa (absolute pressure).