The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Aug. 28, 2007
Hyun-chyl Jung, Yongin-si, KR;
Jae-woo Joung, Suwon-si, KR;
Myung-joon Jang, Seoul, KR;
Yoon-ah Baik, Suwon-si, KR;
Hyun-Chyl Jung, Yongin-si, KR;
Jae-Woo Joung, Suwon-si, KR;
Myung-Joon Jang, Seoul, KR;
Yoon-Ah Baik, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-do, KR;
Abstract
The present invention relates to a method for forming fine wiring comprising: preparing a substrate for a printed circuit board; forming a metal thin sacrificial layer on the substrate using a first metal ink; forming a wiring on the metal thin sacrificial layer by inkjet printing using a second metal ink; and removing a portion of the metal thin sacrificial layer to form a wiring pattern. The method for forming fine wiring according to the invention can improve adhesiveness by using metal thin sacrificial layer and prevent spreading of ink in forming fine wiring.