The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Aug. 21, 2008
Ko Onodera, Tokyo, JP;
Satoshi Kurimoto, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Taketo Sasaki, Tokyo, JP;
Yoji Tozawa, Tokyo, JP;
Osamu Hirose, Tokyo, JP;
Ko Onodera, Tokyo, JP;
Satoshi Kurimoto, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Taketo Sasaki, Tokyo, JP;
Yoji Tozawa, Tokyo, JP;
Osamu Hirose, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.