The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Dec. 17, 2009
Hsin-yuan Peng, Xinwu Township, Taoyuan County, TW;
Shen-ta Yang, Taipei, TW;
Chia-tin Chung, Toufen Township, Miaoli County, TW;
Hsin-Yuan Peng, Xinwu Township, Taoyuan County, TW;
Shen-Ta Yang, Taipei, TW;
Chia-Tin Chung, Toufen Township, Miaoli County, TW;
Paragon Semiconductor Lighting Technology Co., Ltd., Taoyuan County, TW;
Abstract
An LED package structure for increasing heat-dissipating and light-emitting efficiency includes a substrate unit, an alloy unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a first conductive pad, a second conductive pad and a chip-placing pad. The alloy unit has a Ni/Pd alloy formed on the chip-placing pad. The light-emitting unit has an LED chip positioned on the Ni/Pd alloy of the alloy unit by solidified solder ball or glue. The conductive unit has two conductive wires, and the LED chip is electrically connected to the first conductive pad and the second conductive pad by the two conductive wires, respectively. The package unit has a light-transmitting package gel body formed on the top surface of the substrate body in order to cover the light-emitting unit and the conductive unit.