The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Aug. 27, 2010
Low temperature curable photosensitive resin composition and dry film manufactured by using the same
Kwang-joo Lee, Daejeon, KR;
Joo-eun Ko, Daejeon, KR;
Byung-nam Kim, Seoul, KR;
Heon-sik Song, Daejeon, KR;
You-jin Kyung, Daejeon, KR;
Hee-jung Kim, Daejeon, KR;
Kwang-Joo Lee, Daejeon, KR;
Joo-Eun Ko, Daejeon, KR;
Byung-Nam Kim, Seoul, KR;
Heon-Sik Song, Daejeon, KR;
You-Jin Kyung, Daejeon, KR;
Hee-Jung Kim, Daejeon, KR;
LG Chem, Ltd., Seoul, KR;
Abstract
The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.