The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Dec. 08, 2008
Xaver Muenz, Heidelberg, DE;
Bernd Mayer, Heidelberg, DE;
Christian Scheffner, Eppelhelm, DE;
Rajat K. Agarwal, Duesseldorf, DE;
Michael S. Puckett, Holly, MI (US);
Gregory A. Ferguson, Harrison Township, MI (US);
Olaf Lammerschop, Krefeld, DE;
Xaver Muenz, Heidelberg, DE;
Bernd Mayer, Heidelberg, DE;
Christian Scheffner, Eppelhelm, DE;
Rajat K. Agarwal, Duesseldorf, DE;
Michael S. Puckett, Holly, MI (US);
Gregory A. Ferguson, Harrison Township, MI (US);
Olaf Lammerschop, Krefeld, DE;
Henkel AG & Co. KGaA, Duesseldorf, DE;
Abstract
Expandable, thermally curable compositions containing at least one epoxy resin, at least one polyester, at least one blowing agent, and at least one curing agent are useful as adhesives and structural reinforcement materials. When foamed and adhered to a metal substrate surface, such polyester-modified foamable compositions can exhibit improved adhesion to the substrate surface after exposure to a corrosive environment, as compared to compositions that do not contain polyester. Furthermore, these compositions can exhibit improved flow properties in the uncured state at temperatures between 50 and 100° C. They are granulatable, with the granules produced thereby having non-tacky surfaces at room temperature and being capable of being readily processed into molded objects by injection molding processes.