Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

Abstract

To provide a substrate processing method and a semiconductor chip manufacturing method that enable low-cost formation of a mask for etching using plasma etching. During formation of a mask used in plasma dicing for separating a semiconductor waferinto discrete semiconductor chipsby means of etching using plasma processing, there is adopted a method including printing a lyophobic liquid in an area on a rear surfacethat is to be an objective of etching, thereby forming a lyophobic pattern made up of lyophobic films; supplying a low viscosity resinand a high viscosity resin, in this sequence, to the rear surfaceon which the lyophobic pattern is formed, thereby forming a resin filmthat is thicker than the lyophobic filmsin an area where the lyophobic filmsare not present; and curing the resin film, to thus form a mask* that covers an area except for the area to be etched. Thus, a mask for etching purpose can be formed at low cost without use of a high-cost method, like photolithography.