The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2012

Filed:

Feb. 08, 2012
Applicants:

Wei Tian, Bloomington, MN (US);

Dexin Wang, Eden Prairie, MN (US);

Venugopalan Vaithyanathan, Bloomington, MN (US);

Yang Dong, Edina, MN (US);

Muralikrishnan Balakrishnan, Bloomington, MN (US);

Ivan Petrov Ivanov, Apple Valley, MN (US);

Ming Sun, Eden Prairie, MN (US);

Dimitar Velikov Dimitrov, Edina, MN (US);

Inventors:

Wei Tian, Bloomington, MN (US);

Dexin Wang, Eden Prairie, MN (US);

Venugopalan Vaithyanathan, Bloomington, MN (US);

Yang Dong, Edina, MN (US);

Muralikrishnan Balakrishnan, Bloomington, MN (US);

Ivan Petrov Ivanov, Apple Valley, MN (US);

Ming Sun, Eden Prairie, MN (US);

Dimitar Velikov Dimitrov, Edina, MN (US);

Assignee:

Seagate Technology LLC, Scotts Valley, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

Programmable metallization memory cells having a planarized silver electrode and methods of forming the same are disclosed. The programmable metallization memory cells include a first metal contact and a second metal contact, an ion conductor solid electrolyte material is between the first metal contact and the second metal contact, and either a silver alloy doping electrode separates the ion conductor solid electrolyte material from the first metal contact or the second metal contact, or a silver doping electrode separates the ion conductor solid electrolyte material from the first metal contact. The silver electrode includes a silver layer and a metal seed layer separating the silver layer from the first metal contact.


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