The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2012

Filed:

Aug. 05, 2009
Applicants:

Koji Hayashi, Chiba, JP;

Yoshiyuki Takahashi, Chiba, JP;

Ichirou Ogura, Chiba, JP;

Inventors:

Koji Hayashi, Chiba, JP;

Yoshiyuki Takahashi, Chiba, JP;

Ichirou Ogura, Chiba, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); C08L 61/00 (2006.01); C08L 63/00 (2006.01); C08L 85/02 (2006.01); C08G 59/62 (2006.01); C07F 9/28 (2006.01); C07F 9/547 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).


Find Patent Forward Citations

Hayashi, Koji. (2012). Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor sealing material (U.S. Patent No. 8288003). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8288003

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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