The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Feb. 08, 2010
Kyung-soo Kim, Daejeon, KR;
Taeyoung Jang, Daejeon, KR;
Chang-wan Ha, Daejeon, KR;
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Abstract
Disclosed is an electronic component bonding method which interposes a bonding resin between first and second electronic components to bond the first and second electronic components to each other. The electronic component bonding method includes providing the bonding resin between the first and second electronic components, aligning the first and second electronic components with each other, pre-curing the bonding resin to generate elasticity in the bonding resin, performing a main curing operation to apply vibration energy to the bonding resin, which has elasticity according to pre-curing, to securely fix the first and second electronic component to each other, and control the amplitude of the vibration energy applied during the main curing operation to be restricted within an elastic region of the bonding resin.