The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Apr. 28, 2011
Yoshitake Nishiuma, Chiyoda-ku, JP;
Koji Hashimoto, Chiyoda-ku, JP;
Yoshitake Nishiuma, Chiyoda-ku, JP;
Koji Hashimoto, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate. An electronic substrate device according to the present invention, in which a base member (A) includes a central protruding portion (A) which is accommodated in a penetrating portion (A) while facing a die pad (A) through an intermediation of a first gap (G), and first separated protruding portions (and) which are provided around the central protruding portion (A) and have a height dimension smaller than that of the central protruding portion (A), the first separated protruding portions (and) having a top surface which abuts a rear surface portion of the electronic substrate (A) to form a second gap (G), and in which a first heat transfer bond (A) which is a heat conductive adhesive is applied to the first gap (G) and the second gap (G) communicating with the first gap (G).