The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Nov. 30, 2009
Heung Bok Ryu, Gyeonggi-do, KR;
Jang Ho Park, Gyeonggi-do, KR;
Young Key Kim, Gyeonggi-do, KR;
Ki Won Suh, Gyeonggi-do, KR;
Yun Gab Choi, Seoul, KR;
Heung Bok Ryu, Gyeonggi-do, KR;
Jang Ho Park, Gyeonggi-do, KR;
Young Key Kim, Gyeonggi-do, KR;
Ki Won Suh, Gyeonggi-do, KR;
Yun Gab Choi, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-do, KR;
Abstract
The present invention provides an array type chip resistor including: a substrate having a plurality of grooves formed on both sides thereof at equal spaces; lower electrodes formed on both sides of a bottom surface of the substrate; upper electrodes formed on both sides of a top surface of the substrate; side electrodes electrically connected to the upper and lower electrodes; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes. The array type chip resistor can prevent the resistive element from being damaged due to external impact when mounted since the resistive element is printed inside of the lower electrodes of the bottom surface of the substrate.