The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Nov. 19, 2008
Yasushi Yamada, Nishikamo-gun, JP;
Yuji Yagi, Nissin, JP;
Yoshikazu Takaku, Sendai, JP;
Ikuo Ohnuma, Shibata-gun, JP;
Kiyohito Ishida, Sendai, JP;
Takashi Atsumi, Okazaki, JP;
Ikuo Nakagawa, Kariya, JP;
Mikio Shirai, Toyota, JP;
Yasushi Yamada, Nishikamo-gun, JP;
Yuji Yagi, Nissin, JP;
Yoshikazu Takaku, Sendai, JP;
Ikuo Ohnuma, Shibata-gun, JP;
Kiyohito Ishida, Sendai, JP;
Takashi Atsumi, Okazaki, JP;
Ikuo Nakagawa, Kariya, JP;
Mikio Shirai, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Tohoku University, Sendai-shi, JP;
Abstract
A zinc based solder materialof the present invention is prepared by providing on the surface of a zinc based material, from which an oxide filmhas been removed or at which an oxide filmdoes not exist, with a coating layercontaining primarily a metal whose oxide is more easily reducible than the oxide film. In a joined body and a power semiconductor module of the present invention, the zinc based solder materialis used in the joining portion, and after joining, the coating layerdoes not exist.