The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Jul. 14, 2006
IN Tai Jin, Busan, KR;
In Tai Jin, Busan, KR;
Sungwoo Hitech Co., Ltd., Pusan, KR;
Pukyong National University Business Incubator Center, Busan, KR;
Abstract
A bonding apparatus of metal plates includes an upper mold having a first guide pathway formed vertically inside thereof; a middle mold having a second guide pathway formed vertically inside thereof, where the middle mold is disposed under the upper mold; a lower mold having a metal removing pathway formed vertically inside thereof, where the lower mold is disposed under the middle mold; a heating unit for heating the metal plates and a metal tape; a punch for applying a bonding load to the metal plates; a clamping unit that applies a clamping load for clamping the metal plates to the upper mold; and a bonding unit that applies the bonding load to the punch for bonding the metal plates.