The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Feb. 22, 2011
Yung-chieh Chen, Tu-Cheng, TW;
Cheng-hsien Lee, Tu-Cheng, TW;
Po-chuan Hsieh, Tu-Cheng, TW;
Shou-kuo Hsu, Tu-Cheng, TW;
Shin-ting Yen, Tu-Cheng, TW;
Dan-chen Wu, Tu-Cheng, TW;
Jia-chi Chen, Tu-Cheng, TW;
Yung-Chieh Chen, Tu-Cheng, TW;
Cheng-Hsien Lee, Tu-Cheng, TW;
Po-Chuan Hsieh, Tu-Cheng, TW;
Shou-Kuo Hsu, Tu-Cheng, TW;
Shin-Ting Yen, Tu-Cheng, TW;
Dan-Chen Wu, Tu-Cheng, TW;
Jia-Chi Chen, Tu-Cheng, TW;
Hon Hai Precision Industry Co., Ltd., Tu-Cheng, New Taipei, TW;
Abstract
A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.