The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2012

Filed:

Oct. 01, 2004
Applicants:

Hideki Kitamura, Fukushima, JP;

Yoshikichi Teramoto, Tokyo, JP;

Kazuyuki Suzuki, Fukushima, JP;

Naomitsu Nishihata, Tokyo, JP;

Yasuhiro Suzuki, Fukushima, JP;

Inventors:

Hideki Kitamura, Fukushima, JP;

Yoshikichi Teramoto, Tokyo, JP;

Kazuyuki Suzuki, Fukushima, JP;

Naomitsu Nishihata, Tokyo, JP;

Yasuhiro Suzuki, Fukushima, JP;

Assignee:

Kureha Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 11/105 (2006.01); C04B 35/00 (2006.01); C08G 63/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductive film formed from a resin composition comprising poly(ether ether ketone) and a conductive filler, wherein the average value of its thickness is 30 to 250 μm, the maximum value of the thickness is 1 to 1.3 times as much as the minimum value thereof, the average value of its volume resistivity is 1.0×10to 1.0×10Ωcm, the maximum value of the volume resistivity is 1 to 30 times as much as the minimum value thereof, and the number of reciprocating folds as determined in accordance with the testing method for folding endurance is at least 5,000 times, and a production process thereof.


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