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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8282846 B1

PDFFull Text
Date of Patent:
Oct. 09, 2012

Filed:

Feb. 27, 2010

Metal interconnect structure with a side wall spacer that protects an arc layer and a bond pad from corrosion and method of forming the metal interconnect structure

Applicant:

Rodney L. Hill, Buxton, ME (US);

Inventor:

Rodney L. Hill, Buxton, ME (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorneys:

Eugene C. Conser

Wade J. Brady, III

Frederick J. Telecky, Jr.

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Sherman Ng

Int. Cl.
CPC ...
C23F 1/00 (2006.01); B44C 1/22 (2006.01); H01B 13/00 (2006.01); H01B 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A metal interconnect structure, which includes a bond pad, an overlying anti-reflective coating layer, an overlying passivation layer, and an opening that exposes a top surface of the bond pad, eliminates corrosion resulting from the anti-reflective layer being exposed to moisture during reliability testing by utilizing a side wall spacer in the opening that touches the side wall of the passivation layer, the side wall of the anti-reflective coating layer, and the top surface of the bond pad.

Find Patent Forward Citations

Hill, Rodney. (2012). Metal interconnect structure with a side wall spacer that protects an arc layer and a bond pad from corrosion and method of forming the metal interconnect structure (U.S. Patent No. 8282846). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8282846

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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