The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Mar. 18, 2009
Tomohisa Ogata, Miyako-gun, JP;
Tomohisa Ogata, Miyako-gun, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
A die comprising molding grooves arranged in a lattice pattern and moldable-material-supplying holes communicating with the molding grooves for molding a ceramic honeycomb structure, the molding grooves having width of 0.05-0.5 mm, the moldable-material-supplying holes being arranged in every intersecting portions of the molding grooves, or in every other intersecting portions of the molding grooves in a checkerboard pattern, and an average distance between the centers of the intersecting portions of the molding grooves, at which the moldable-material-supplying holes are arranged, and the center axes of the moldable-material-supplying holes being 10-100 μm.