The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Aug. 25, 2010
Yoichi Funabiki, Chiba, JP;
Masashi Numata, Chiba, JP;
Yoichi Funabiki, Chiba, JP;
Masashi Numata, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
Providing a method for manufacturing a package capable of improving production efficiency. Providing a method for manufacturing a package including: a base board and a lid board which are bonded to each other; an accommodated article which is sealed in a cavity formed between the base board and the lid board; and a penetration electrode which is disposed in a penetration hole penetrating through the base board so as to electrically connect the accommodated article to the outside, the method including: a penetration hole forming step of forming a penetration hole for the penetration electrodesin the base board; a penetration electrode alignment step of inserting a core portionof a conductive rivet memberinto the penetration hole of the base board; a glass frit filling step of applying a paste-like glass fritonto the other surface of the base board and filling the glass frit into the penetration hole; and a baking step of baking and curing the glass frit, wherein the glass frit filling step involves forming a glass frit filling portionhaving a larger diameter than the penetration hole and filling the glass frit also into the glass frit filling portion.