The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Jun. 25, 2007
Ichiro Hirata, Tokyo, JP;
Ichiro Hirata, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
Board warp analysis includes dividing a temperature profile with respect to an electronic component by a predetermined time. A relaxation elastic modulus of the electronic component corresponding to the divisional time is obtained by shifting on a time base of a master curve related to the electronic component A curing degree of the electronic component is calculated based on a relationship between a time after shift and an actually applied temperature. A warp of the electronic component is analyzed based on a relaxation elastic modulus on the master curve or a relaxation elastic modulus calculated based on a relationship between the curing degree and the elastic constant according to a value of the curing degree calculated.