The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8279618 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 02, 2012

Filed:

Mar. 04, 2010
Applicant:

Yutaka Fukuda, Echizen, JP;

Inventor:

Yutaka Fukuda, Echizen, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/00 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit substrate includes protruding terminals and has a structure that ensures an excellent connection with an electronic component, such as an IC. The circuit substrate on which an IC is to be mounted includes terminals that are to be electrically connected to solder bumps located on the IC. The terminals protrude from the mounting surface of a substrate body on which the IC is to be mounted. The sectional area of the top surface of each of the terminals is about 1.2 times the sectional area of each of the terminals on the mounting surface.


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Fukuda, Yutaka. (2012). Circuit substrate and circuit substrate manufacturing method (U.S. Patent No. 8279618). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8279618

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