The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2012

Filed:

Nov. 16, 2010
Applicants:

Steven Jay Millard, Mechanicsburg, PA (US);

Richard Elof Hamner, Hummelstown, PA (US);

Robert Neil Mulfinger, York Haven, PA (US);

Jason M'cheyne Reisinger, Carlisle, PA (US);

Inventors:

Steven Jay Millard, Mechanicsburg, PA (US);

Richard Elof Hamner, Hummelstown, PA (US);

Robert Neil Mulfinger, York Haven, PA (US);

Jason M'Cheyne Reisinger, Carlisle, PA (US);

Assignee:

Tyco Electronics Corporation, Berwyn, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flexible circuit assembly including a pair of mating panels. Each of the mating panels has an engagement face and a power contact. The circuit assembly also includes adjacent first and second flex interconnects that mechanically and electrically couple the mating panels. The first and second flex interconnects extend alongside each other and have respective interior surfaces. The first and second flex interconnects are stacked with respect to each other such that the interior surfaces face each other and define a heat-dissipating interspace therebetween. The circuit assembly also includes a plurality of power conductors that extend through the first and second flex interconnects between the mating panels. The power conductors are electrically parallel to one another between the power contacts. At least one of the power conductors extends proximate to the interior surface of one of the first and second flex interconnects.


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