The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Jun. 30, 2010
Alex Horng, Kaohsiung, TW;
Chi-hung Kuo, Kaohsiung, TW;
Chih-hao Chung, Kaohsiung, TW;
Chung-ken Cheng, Kaohsiung, TW;
Jui-feng Wang, Kaohsiung, TW;
Alex Horng, Kaohsiung, TW;
Chi-Hung Kuo, Kaohsiung, TW;
Chih-Hao Chung, Kaohsiung, TW;
Chung-Ken Cheng, Kaohsiung, TW;
Jui-Feng Wang, Kaohsiung, TW;
Sunonwealth Electric Machine Industry Co., Ltd., Kaohsiung, TW;
Abstract
A cooling module assembly method includes forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, with the at least one heat-generating element aligned with and covering the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole.