The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2012

Filed:

Oct. 28, 2009
Applicants:

Jong-jin Lee, Gwangju-si, KR;

Hyun-seo Kang, Gwangju-si, KR;

Jai-sang Koh, Gwangju-si, KR;

Inventors:

Jong-jin Lee, Gwangju-si, KR;

Hyun-seo Kang, Gwangju-si, KR;

Jai-sang Koh, Gwangju-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A bidirectional optical transceiver module with a temperature control function is provided. The bidirectional optical transceiver module includes a package configured to have a flat bottom surface and include two windows used for optical transmission and reception; a ferrule configured to be coupled to one side of the package and allow an optical fiber to be inserted therein; an optical receiver module configured to be coupled to another side of the package in a direction perpendicular to that of the ferrule coupled to the package; a sub-optical transmitter module configured to be built in the package and include a light-emitting element and a collimating lens used to collimate light from the light-emitting element; an optical filter configured to be built in the package, transmit light from the light-emitting element to the optical fiber and reflect light received through the optical fiber to the optical receiver module; and a temperature regulator configured to be built in the package and control the sub-optical transmitter module to a preset temperature. Accordingly, it is possible to reduce the manufacturing cost of the package, effectively discharge heat, and be more endurable to external impact or vibration.


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