The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Oct. 22, 2010
Alistair D. Bradley, Dublin, OH (US);
Lamar F. Ricks, Lewis Center, OH (US);
Alistair D. Bradley, Dublin, OH (US);
Lamar F. Ricks, Lewis Center, OH (US);
Honeywell International Inc., Morristown, NM (US);
Abstract
A method of packaging for chip-on-board pressure sensor that includes a buffer layer with a coefficient of thermal expansion (CTE) intermediate between the transducer and a main chip-on-board substrate by which thermally induced package stresses can be greatly reduced or eliminated. Additionally, the use of a buffer layer with higher stiffness (elastic modulus) than the chip-on-board substrate further prevents or reduces flexural (bending) stresses from being transferred to the transducer. Such a buffer layer also enables a wider choice of materials for bonding and stable performance of pressure sensor in harsh media and environmental conditions. The pressure transducer can be adhesively bonded to a ceramic layer, which in turn can be adhesively bonded to an epoxy laminate chip-on-board substrate.