The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Feb. 18, 2009
Kazuyuki Ono, Anjo, JP;
Yoshio Tanaka, Koka, JP;
Kiyoshi Nakajima, Higashiomi, JP;
Naoto Kuratani, Kameoka, JP;
Tomofumi Maekawa, Osaka, JP;
Kazuyuki Ono, Anjo, JP;
Yoshio Tanaka, Koka, JP;
Kiyoshi Nakajima, Higashiomi, JP;
Naoto Kuratani, Kameoka, JP;
Tomofumi Maekawa, Osaka, JP;
OMRON Corporation, Kyoto, JP;
Abstract
An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.