The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

Dec. 04, 2009
Applicant:

Hiroyuki Masaki, Shijonawate, JP;

Inventor:

Hiroyuki Masaki, Shijonawate, JP;

Assignee:

Hakko Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/04 (2006.01); H05B 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.


Find Patent Forward Citations

Masaki, Hiroyuki. (2012). Soldering device and method of making same (U.S. Patent No. 8274011). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8274011

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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