The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Aug. 23, 2007
Applicants:
Yoshitsugu Morita, Chiba, JP;
Minoru Isshiki, Chiba, JP;
Tomoko Kato, Chiba, JP;
Inventors:
Assignee:
Dow Corning Toray Company, Ltd., Chiyoda-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08K 3/38 (2006.01); C08K 3/14 (2006.01); C08K 3/22 (2006.01); C08K 3/08 (2006.01); C08K 3/34 (2006.01); C08K 3/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.