The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Dec. 02, 2004
Kouji Tasaki, Chikusei, JP;
Hironori Ishizaka, Chikusei, JP;
Masahito Shibutani, Chikusei, JP;
Kousuke Tanaka, Chikusei, JP;
Masahisa Shinzawa, Chikusei, JP;
Kouji Tasaki, Chikusei, JP;
Hironori Ishizaka, Chikusei, JP;
Masahito Shibutani, Chikusei, JP;
Kousuke Tanaka, Chikusei, JP;
Masahisa Shinzawa, Chikusei, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips, each having external electrodes formed on a pair of opposing surfaces. Oneof the electrodes is arranged on an antenna circuitin a transmission/reception antenna having a slit. Furthermore, a bridging plateis arranged for separately and electrically connecting the other external electrodeto a predetermined position of the corresponding antenna circuit. The method is characterized in that by positioning at least one of the IC chipswith the predetermined position on the corresponding antenna circuitto be mounted, it is possible to arrange the retraining IC chipsat the predetermined positions on the antenna circuitall at once.